| http://www.w3.org/ns/prov#value | - FIG. 3A, more specifically, is a schematic isometric cross-sectional view of a microfeature workpiece 102 and the cover substrate 140 of FIG. 2E. The microfeature workpiece 102 includes a substrate 104 and a plurality of microelectronic dies 110 formed in and/or on the substrate 104.
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