| http://www.w3.org/ns/prov#value | - This is because typically, leaded ICs such as TSOPs are configured with leads that extend beyond the lower plane PL. In order for the lower surface 25 of the respective leaded packaged ICs to contact (either directly or through an adhesive or thermal intermediary) the respective surfaces of the flex circuit, the leads 24 must be typically reconfigured.
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