| http://www.w3.org/ns/prov#value | - The pads PD are opened in the end portions of the unit layers (L1, L2, L3, L4, . . . ), the memory chip comprising a stack of the unit layers is fixed onto a mount board MB by die bonding or the like, and an electrode EL such as land formed on the mount board MB and the pad Pad of each layer of the memory chip are connected by wire bonding or the like.
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