| http://www.w3.org/ns/prov#value | - The metalization of such a pad typically comprises one or more layers of aluminum, silver, gold, ITO, alloys of these metals, or other conductive materials deposited onto the parent wafer of the chip in a vacuum physical vapor deposition process such as electron beam evaporation, ion-assisted deposition, ion-plating, magnetron sputtering, and the like.
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