| http://www.w3.org/ns/prov#value | - The integrated circuit device according to claim 1, wherein said pads are formed of one type of a conductive material selected from a group of Ti, TiN, Al, AlCu alloy, Cu, Ta, TaN and NiCr alloy, or a compound of at least two types of conductive materials selected from said group, or a material containing those conductive materials or said compound. 5.
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