| http://www.w3.org/ns/prov#value | - In die-up BGA packages, the IC die is mounted on a top surface of the substrate or stiffener, in a direction away from the PCB. In die-down BGA packages, the IC die is mounted on a bottom surface of the substrate or stiffener, in a direction towards the PCB. A number of BGA package substrate types exist, including ceramic, plastic (PBGA), and tape (also known as ???flex???).
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