About: http://webisa.webdatacommons.org/11348739

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Field of the Invention This invention relates to semiconductor packages and more particularly to a package suitable for integral mounting on a dissimilar refractory substrate. 2.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com