| http://www.w3.org/ns/prov#value | - A substrate for an integrated circuit package, comprising: a metal core, the metal core including a surface treated in a manner effective to promote adhesion to the surfaceby a dielectric; a dielectric layer adhered to the treated surface of the metal core, the dielectric layer including at least one cavity, the cavity exposing a portion of the treated surface of the metal core; and a circuit on t
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