| http://www.w3.org/ns/prov#value | - Using the resin layer formed of two types of insulating resins having a different modulus of elasticity, the occurrence of resin non-filled portions below the wires is prevented, and the occurrence of an insulation failure, a short circuit or the like due to the contact between the first bonding wires 7 and the second semiconductor element 8 can be retarded effectively.
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