| http://www.w3.org/ns/prov#value | - Useful suppressors typically include polyethers, such as polyethylene glycol, polypropylene glycol, or other polymers, such as polypropylene oxides, which adsorb on the substrate surface, slowing down copper deposition in the adsorbed areas.Inhibitors within the plating solution are used for suppressing copper deposition by initially adsorbing onto underlying surfaces (e.g., substrate surface) and
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