| http://www.w3.org/ns/prov#value | - A seventh aspect of the present invention is a method for producing a semiconductor device of any of the first to the third aspects, comprising the steps of bonding the electrodes disposed at the outer side of the semiconductor element and the electrodes of the lead frames via the outer bonding wires; placing the contact prevention member on the outer bonding wires; and bonding the electrodes disp
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