| http://www.w3.org/ns/prov#value | - The under bump metal (UBM) structure 308 is composed of chromium, titanium, titanium-tungsten alloys, copper, or other alloys of chromium, titanium, tungsten and copper. [0030] With reference to FIG. 12, a film 314 is formed on the leaded bumps 310 to cover top portion 310 a thereof, wherein the film 314 is separated from the passivation layer 303, on the active surface 302 a, by a gap 311.
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