About: http://webisa.webdatacommons.org/117315861

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention relates to a semiconductor package, and more particularly to a ball grid array (BGA) type semiconductor package comprising an organic circuit board and an IC chip mounted on the board by flip chip bonding.
http://www.w3.org/ns/prov#wasQuotedFrom	docstoc.com