About: http://webisa.webdatacommons.org/117334065

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	This invention relates to a complete double lap lapping and polishing machine particularly to an apparatus designed to finish to a required thickness and/or finished polish workpieces such as thin silicon and/or ceramic wafers.
http://www.w3.org/ns/prov#wasQuotedFrom	freepatentsonline.com