| http://www.w3.org/ns/prov#value | - The FIGS. 1(a) to 1(h) of the drawings show the various stages of a method embodying the invention for plating a substrate 1, for example a semiconductor substrate, provided with a layer 2 of an aromatic polymer, such as a polyimide, a polycarbonate or an epoxy, on a surface 1 a of the substrate to be plated.
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