| http://www.w3.org/ns/prov#value | - The overmolding process encloses or encapsulates the transponder and also defines the primary finger gripping surface for a user of the key assembly as shown in FIGS. 56F and 56G. In addition, the overmolding step covers cavities or marks left by transponder positioners in the mold and flaws, such as blemishes, pinholes, and the like in the undermold.
|
