About: http://webisa.webdatacommons.org/12362677

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In a subsequent step, there is a possibility of a thick native oxide film of the Cu alloy being formed in the solder surface to reduce the reliability at the time of joining to the mother chip 10 described below.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com