| http://www.w3.org/ns/prov#value | - Patente US6698646 - Room temperature gold wire bonding - Google PatentesB???squeda Im???genes Maps Play YouTube Noticias Gmail Drive M???s ??Iniciar sesi???n B???squeda avanzada de patentesPatentesThe present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius.
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