About: http://webisa.webdatacommons.org/125504568

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Solder formed on the contact pads of the ball grid array electronic package are used to complete the connection to another electronic component, such as a printed circuit board.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com.au