| http://www.w3.org/ns/prov#value | - As shown in FIG. 4, in the third and fourth process units G3 and G4, there are stacked from the bottom to the top the eight units such as a thermal process unit such as a cooling unit COL for cooling the wafer W at a prescribed temperature, an adhesion unit (AD) for applying a hydrophobic process to the wafer before the resist coating, an alignment unit ALIM for adjusting the position of the wafer
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