About: http://webisa.webdatacommons.org/129253979

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	the present invention enables the filling, without significant voids, of apertures with a conductive material, such as aluminum, wherein the substrate temperature is maintained at a temperature below as little as 350.degree.
http://www.w3.org/ns/prov#wasQuotedFrom	patents.com