About: http://webisa.webdatacommons.org/129655365

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 4 is an exemplary method for manufacturing a dissipative flip chip bonding tool through the use of mixing, molding, and sintering reactive powders;
http://www.w3.org/ns/prov#wasQuotedFrom	google.es