About: http://webisa.webdatacommons.org/130390101

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Finally, new signal device connections 320, such as solder balls or other conductive bumps, are formed in the plurality of openings 318 contacting the underlying circuit connection layer 314.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com