| http://www.w3.org/ns/prov#value | - Preferably, the packaged device is a device having a high density of contact terminals, e.g., solder spheres, bumps, contact pads, leads, etc., disposed on a surface thereof For example, the high density packaged device may be a ball grid array package as shown in FIG. 1A and in the various other illustrative embodiments shown in the other figures described herein.
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