| http://www.w3.org/ns/prov#value | - In one embodiment, the condensation process involves flowing oxygen gas and HCl gas (e.g. 6%) or other chlorine bearing gas (and in some embodiment argon or nitrogen (N2) as diluents) across wafer 1101 at a temperature e.g. of 1050 degrees for e.g. 30???60 minutes.
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