| http://www.w3.org/ns/prov#value | - As defined below, the ???core??? can be readily ???stacked up??? with other layers, including conductors and dielectric layers (including of dielectric materials other than those taught herein), and bonded together (preferably using conventional PCB lamination processing) to form a much thicker, multilayered carrier or multilayered PCB. The laminate so formed is then subjected to further processin
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