| http://www.w3.org/ns/prov#value | - However, for the sake of simplicity, discussions will concentrate mainly on exemplary use of a simple three-dimensional (3-D) wafer-to-wafer vertical stack and an etch stop layer for metallic wafer-to-wafer and die-to-die bonding in such a three-dimensional (3-D) wafer-to-wafer vertical stack, although the scope of the present invention is not limited thereto.
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