About: http://webisa.webdatacommons.org/135147900

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole DEpson inkjet semiconductor marking system prevents die damage
http://www.w3.org/ns/prov#wasQuotedFrom	electroiq.com