PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The present invention is a method and apparatus for capacitively testing a semiconductor die or wafer having first and second die terminals.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com.au