| http://www.w3.org/ns/prov#value | - After the bumps 198 are connected to the tin-containing layer 70 on the bottom surface of the inner leads 68 using a thermal pressing process, a polymer material 74, such as epoxy or polyimide, can be formed between the semiconductor chip 204 and the tin-containing layer 70 on the bottom surface of the inner leads 68, and enclosing the bumps 198.
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