| http://www.w3.org/ns/prov#value | - An example is a method in which a semiconductor wafer is coated with an insulative resin, the insulative resin is hardened by heating, a through hole is formed in the insulative resin with an excimer laser so that an aluminum electrode is exposed, the hole is filled with a conductive paste, the conductive paste is heated and pressurized and the surface is ground.
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