| http://www.w3.org/ns/prov#value | - When carrying out a wafer test using the machine 10, probes 18b are electrically connected to bonding pads (electrodes) of each chip (device pattern) formed in a wafer, and test signals are supplied from the tester to the chip, and response signals are supplied from the chip to the tester, thereby determining the electric characteristics of the chip.
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