About: http://webisa.webdatacommons.org/13837174

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	This invention relates to semiconductor devices, and more particularly to a semiconductor device in which the generation of cracks caused by thermal stress is suppressed in the outer peripheral area of a semiconductor chip.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com