| http://www.w3.org/ns/prov#value | - The seed film 106 is formed so as to promote the growth of copper grains when burying the interconnection use grooves and the contact holes with copper.Next, as shown in FIG. 14, a metal film 107 made of copper is formed on the barrier film 105 to a thickness of for example about 2000 nm so as to bury the contact holes 103 and the interconnection use
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