| http://www.w3.org/ns/prov#value | - s covered and fixed by a resin such as epoxy resin such that the bumps 5 are contacted closely on the printed board. [0041] When the bumps 5 are contacted closely to the printed board, an ultrasonic wave vibration can be further applied to the bumps 5 by using a supersonic wave generating apparatus so as to deposit the bumps 5 on the printed board; thus, contact between the bumps 5 and the printed
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