About: http://webisa.webdatacommons.org/14040277

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	BRIEF SUMMARY OF THE INVENTION [0020] The present invention provides a method and apparatus for balancing stresses resulting from application of a passivation layer or other layer on the front side of a semiconductor wafer.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com