PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • FIG. 26 is a cross-sectional drawing for explaining the feature in which grooves are formed from the back surface of the wafer 10 in the third embodiment of the present invention.
http://www.w3.org/ns/prov#wasQuotedFrom
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