PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • In particular, FIG. 3(c) shows a plurality of semiconductor chips (residing inside the molding portions 3) arranged at a predetermined interval on a substrate 4 formed of material such as resin or tape.
http://www.w3.org/ns/prov#wasQuotedFrom
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