| http://www.w3.org/ns/prov#value | - wire bonding; an adhesive/spacer structure is formed upon the active side of the first die; and a device such as a die or a package or a heat...http://www.google.es/patents/US8030134?utm_source=gb-gplus-sharePatente US8030134 - Stacked semiconductor package having adhesive/spacer structure and insulation B???squeda avanzada de patentes N???mero de publicaci???nUS8030134 B2Tipo de publicaci???nConc
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