About: http://webisa.webdatacommons.org/146254534

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Following the EDS process, a conventional CSP packaging process is performed using processes such as wafer sawing, die bonding, wire bonding, encapsulation, and mounting and attaching of solder balls or solder bumps, in step 110.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com