| http://www.w3.org/ns/prov#value | - However, since heat loss is a problem mainly at edge 404c of wafer 404, the use of quartz for spindle 402, i.e., under the center of wafer 404, and graphite or silicon carbide for wafer surround ring 401, i.e., under and around edge 404c of wafer 404, may provide the desired temperature uniformity in wafer 404.
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