About: http://webisa.webdatacommons.org/146497050

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Portions of conducting layer 62 and upper metal layer 66 above the horizontal plane of dielectric layer 54 are then removed by a planarization process, such as CMP, to form a completely enveloped, or clad, interconnect structure.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com