PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole DRudolph wins TSV inspection systems order
http://www.w3.org/ns/prov#wasQuotedFrom
  • electroiq.com