About: http://webisa.webdatacommons.org/149195047

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	20110135015COOLING DEVICES IN SEMICONDUCTOR PACKAGES - An embodiment of the present invention is a technique to fabricate a cover assembly.
http://www.w3.org/ns/prov#wasQuotedFrom	faqs.org