About: http://webisa.webdatacommons.org/149292132

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Any bonding composition remaining in the device areas can be easily removed using the original solvent that was part of the composition prior to drying as well as using solvents such as xylene, NMP, and dimethyl sulfoxide.
http://www.w3.org/ns/prov#wasQuotedFrom	freshpatents.com