| http://www.w3.org/ns/prov#value | - As described above, those preferably usable as the pressurizing method for the optical waveguide plate 12 and the actuator substrate 18 include the various loading methods such as the loading based on the weight, the vacuum packaging method, the CIP method (hydrostatic pressure loading method), the loading based on the flip chip bonding, the constant value control, and the low pressure press metho
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