| http://www.w3.org/ns/prov#value | - strate 11 and a ninth step for dissolving the upper and lower resin layers 41 and 42. [0097] As shown in FIG. 8A and FIG. 9A, the first step is a step for forming the element substrate 11, in which the plural heaters 20 and predetermined wirings for applying voltage to the heaters 20 are provided on a main surface of a silicon chip, for example, by patterning treatment and an insulation film 21 fo
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