| http://www.w3.org/ns/prov#value | - As set forth in the cited U.S. Pat. No. 4,776,978 patent, metal particles, such as copper, in the via paste undergo sintering with attendant shrinkage of the thick film pattern (also consisting of the paste) during the initial phase of the sintering cycle whereas the ceramic and glass particles (of the ceramic substrate containing the vias) undergo sintering during the intermediate and final phase
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