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Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In U.S. Pat. Nos. 5,778,869 and 4,465,550, methods and apparatuses are described for slicing solid materials, especially semiconductor ingots, the entirety of each are incorporated herein by reference.
http://www.w3.org/ns/prov#wasQuotedFrom	google.fr