| http://www.w3.org/ns/prov#value | - A semiconductor encapsulating epoxy resin composition comprising,(A) an epoxy resin of formula (1), having a melt viscosity of 0.1 to 2.5 poises as measured at 150??? C. by a cone-and-plate type ICI viscometer: ##STR8## wherein R1 is hydrogen, alkyl of 1 to 4 carbon atoms, or phenyl, p is an integer of 1 to 4, and n is an integer of 0 to 10, (B) a phenolic resin of formula (2): ##STR9## wherein R2
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